Park NX15 is not only very suitable for researchers in shared laboratories to handle various samples and conduct multivariate experiments, but also equally suitable for fault analysis engineers to handle systematic work on wafers.

Convenient sample measurement (including multiple sample scans)

Automatically image multiple samples at once

The designed multi sample chuck can be loaded at most once9 individual samples (optional)

All electricThe XY sample stage can reach a stroke of 150 mm x 150 mm

Accurate by eliminating scanner crosstalkXY scan

Independent closed loopXY and Z flexible scanners

orthogonalXY scan

Real and reliable sample surface morphology information can be retained without software processing

True non-contact mode achieves probe lifespan, imaging resolution, and effective protection of samples

QuicklyZ-servo speed, achieving true non-contact mode

Minimizing needle tip wear enables long-term high-quality and high-resolution imaging

Multiple modes and options

Comprehensive measurement mode and characterization method

Can realize optional accessories and upgrade expansion functions

Used for fault analysisPrecision electrical measurement of (FA)

Park NX15parameter

Scanner

Z scanner

Flexible guided high thrust scanner

Z-scan range:15 μ m (30 μ m optional)

XY scanner

Closed loop control single module flexibleXY scanner

Scanning range:100μmx 100μm

optics

Coaxial optical system with visual camera

objective lense:10x magnification

Field of view:

480 μ m X 360 μ m (default 1.2 megapixel visual camera)

840 μ m X 630 μ m (default 5-megapixel visual camera)

Circuit system

signal processing

ADC:be used for X. 24 bit ADC for Y and Z scanner position sensors

DAC:be used for X. 20 bit DAC for Y and Z scanner positioning

Sample stand

Z displacement table travel range:25.5 mm

XY displacement table travel range:150 mm X 150mm

Sample size:Satisfying150mm wafer sample